光ファイバーとチップを立体的な端面構造で結合

Scaling optical input/output for co-packaged optics is limited by the fiber-to-chip interface. Conventional edge coupling offers low loss and broad bandwidth but confines channels to a single row along the chip facet. On the other hand, surface couplers are either narrowband or difficult to fabricate with high yield and, importantly, compete with back-end metal routing. In this work, we introduce volumetric edge coupling, in which the chip edge is structured in three dimensions so that optical coupling can occur over a two-dimensional region rather than along a single line, providing a route toward interfacing multiple waveguides with multiple cores of a multicore fiber while preserving optical access from the chip perimeter. We investigate a single-channel realization based on total-internal-reflection (TIR)-mediated evanescent coupling through the 54.7$^\circ$ sidewall of a KOH-etched silicon cavity, with the coupling profile shaped by a wedged buried-oxide ridge. Finite-difference time-domain simulations predict a peak coupling efficiency of 88% (-0.56 dB) at 1550 nm and a 1-dB bandwidth of 86.45 nm spanning the C-band. The design further exhibits a vertical alignment tolerance of approximately $\pm$2 $\mu$m, weak sensitivity to transverse offsets up to 5 $\mu$m, and a $\pm$0.8$^\circ$ 1-dB angular tolerance. The reflected optical field also provides a potential alignment signal, offering a path toward reduced active alignment overhead in future multicore implementations.