複数ホストのAI計算装置を統一的に接続する基盤

Large-model parameters have grown beyond the capacity of a single xPU, dispersing across multiple xPUs spanning distinct host domains, where xPU-to-xPU communication dominates overall system efficiency. Existing scale-up interconnect remains inadequate: network-based solutions built on Ethernet--such as RoCE (RDMA over Converged Ethernet)--introduce specific message-semantics and protocol-stack characteristics, and rely on fragmented per-host addressing, while conventional host-based fabrics are confined to a single host domain and lack cross-host unified addressing. This paper presents Co-Fabric, a bus-based interconnect that, unlike conventional bus designs, breaks host-domain boundaries to deliver unified xPU interconnection for scale-up superpods. Co-Fabric makes three contributions: a streamlined four-layer protocol stack achieving nanosecond-scale processing latency with native reliability; a cross-domain scaling and P2P mechanism that routes using port identifiers embedded in the packet header; and a unified address space built on shadow-device auto-enumeration. On a 64-xPU 3D-Mesh system, Co-Fabric cuts inter-node communication latency by over 50% and improves bandwidth by 2-5x over RoCE, accelerating DeepSeek R1 inference by 30%-80%. Moreover, since its streamlined four-layer protocol stack and higher data-communication efficiency reduce protocol and processing overhead relative to the Ethernet-based RoCE stack, Co-Fabric cuts the cost and power of the interconnect itself by up to 80% and 5%, respectively. These results demonstrate Co-Fabric's advantage for AI computing centers.