異方性多層材の縦方向の熱境界伝導を高速計算

Vertical thermal interfaces occur in both engineered and natural materials. Their vertical thermal boundary conductance can differ from the horizontal counterpart, requiring dedicated characterization. Yet current thermal metrology resolves vertical thermal boundary conductance only in restricted geometries such as two bulk media, for lack of an efficient forward solution that admits anisotropy, multilayers, and depth-dependent vertical thermal boundary conductance together. We present a Green's-function boundary integral equation (GBIE) method that couples transfer-matrix Green's functions to an interface-only integral equation for depth-dependent $G_v(z)$, supporting dissimilar orthotropic multilayers ($k_x\neq k_y\neq k_z$) on either side and horizontal conductance $G_h$. For anisotropic film-on-substrate multilayers with films from $1~\mu\mathrm{m}$ to $100~\mathrm{nm}$, the GBIE agrees with three-dimensional finite element method (FEM) predictions to within one percent mean normalized phase and amplitude error, while running $29\text{--}210\times$ faster and reducing peak memory by factors of $120\text{--}450$ in single-core tests; a JIT-compiled JAX implementation reaches up to $4100\times$ on a matched 16-core comparison. The GBIE further reproduces a continuous film over a buried interface, representative of a thermoreflectance measurement, and a finite-depth interface with depth-dependent $G_v(z)$. The GBIE accommodates lateral-to-film-thickness ratios above $10^{5}$, where volumetric FEM can become computationally prohibitive. These results establish an efficient forward solution for vertical-interface heat transport in systems ranging from microelectronic device sidewalls to grain boundaries in polycrystalline solids.